Rapidus has successfully begun installing ASML's Twinscan NXE:3800E EUV lithography system at its Innovative Integration for Manufacturing (IIM-1) facility in Chitose, Hokkaido, marking a significant ...
SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic ...
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected. Save ...
TOKYO/SEOUL, March 31 (Reuters) - South Korea's Samsung Electronics Co Ltd (005930.KS), opens new tab is considering setting up a chip packaging test line in Japan, five people said, to bolster its ...
The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...
When classic 2D scaling dominated, the industry’s center of gravity was disinflationary: Chip average selling prices (ASPs) trended lower, and wafer fab equipment (WFE) growth was intermittent. In ...
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