EDN

Chip-and-package co-design relieves pressure on complex designs

The vise is closing down on design departments.Manufacturers want more capabilitiesin their products than ever before. It’simperative for manufacturers to remaincompetitive. Marketing, meanwhile,wants ...
Yahoo

Cadence SiP Technologies and Allegro Package Designer Optimized for Hand-Held Consumer Electronics Market

TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...
EDN

IC packages and thermal design

Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...
Electronic Design

Advanced Package Design Fosters Smaller, More Efficient Semiconductors

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Smithsonian Magazine

Package Design: the Art of Selling, All Wrapped Up

In his San Francisco studio, package designer Primo Angeli explains that "there is a relationship between consumers and packages, a psychodrama, really." Indeed, packages are "silent salesmen" that ...