The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

No automatic method exists to insert the different and multiple RLC package/PCB models of the Chip in Mix Mode (RTL + Spice) AMS verification. Such additions of components are inserted in simulation ...

Microsoft’s Azure DevOps offers a feed-based artifact repository for your own and third-party code that’s well worth a look. Continuous integration and continuous delivery (CI/CD) is one of the ...

The Redmond-based Microsoft Corporation has successfully turned on the PowerShell Module Browser site. Earlier this month, the Microsoft Docs team announced that the PowerShell Module Browser, a web ...

Very few Android projects are an island! The majority of Android projects have dependencies on a number of other components, including third party Android libraries. An Android library contains the ...

A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...