The packaging industry enters 2026 under regulatory and sustainability pressures after a year of smart and bio-based ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

Automotive radar systems are typically composed of an antenna, front-end radar sensor and back-end signal processor. Current state-of-the-art automotive radar systems make use of the latest integrated ...

Digital packaging bridges the gap between limited physical space and the growing demand for transparency, playing a crucial role in delivering sustainability insights that benefit brands and consumers ...

WEST LAFAYETTE, Ind. – A large-scale manufacturing process to improve food packaging and keep groceries fresher longer has received top honors at one of the world’s largest technical conferences for ...

RICHMOND, Va. (WRIC) — Gov. Terry McAuliffe announced that TemperPack will expand it’s headquarters and manufacturing operation in Richmond on Wednesday. TemperPack is a manufacturer of sustainable ...

The patent pending packaging is made with a PE-based recyclable film designed to replace laminated, nonrecyclable structures used in snack packaging. ProAmpac's new ProActive Recyclable R-2200 ...

Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel is promoting this advanced packaging technology as a key building block for ...

Syntegon is a leading single-source supplier of processing, packaging, and automation technology to the food and pharma industries. Our portfolio ranges from standalone, entry-level machines to fully ...

Amkor Technology's advanced packaging leadership and partnership with TSMC are key growth drivers, targeting a $37 per share price within a year. AMKR's expansion in Korea, Vietnam, and a new facility ...

The funding will upgrade processing and packaging technology, boosting halal-certified output and improving food safety and ...

Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...