Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in ...

Emil Otto is aiming at joining steel, stainless steel, brass and copper objects below 450°C with three tin-based soft-soldering pastes. “The soldering and tinning pastes do not require zinc chloride, ...

Most assemblers in the electronic industry use no-clean solder paste mainly to eliminate having to clean the circuit-board assemblies. Manufacturers such as Rush PCB prefer to run all production with ...

Molded for lead-free process requirements, Multicore LF328 is a halide-free, no-clean, lead-free solder paste suitable for high-volume, stencil-printing applications with chip-scale-package lead ...

SHENMAO America, Inc. is proud to announce the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates. This no-clean, halogen-free solder ...

FCT assembly is offering a variety of anti-tombstoning option with each of its solder pastes. “The anti-tombstoning solder pastes present an excellent way to reduce the potential for tombstoning”, ...

When doing surface-mount assembly you can certainly use a soldering iron in the traditional way, but it’s far more convenient to cover the pads with solder paste, place the components, and bake the ...

BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...