Semiconductor Engineering

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Electronic Design

Thermal Simulation Boosts Reliability and Shortens Time-To-Market in Power Electronics System Designs

The drive for better efficiency in the power electronics industry has generated enormous gains in the last few years. The design of power semiconductors has improved, silicon carbide (SiC) and gallium ...
Electronics Weekly

Thermal simulation compromised by hardware limitations

29% of thermal engineers are having to compromise the accuracy of their simulations due to hardware limitations, according to The State of Thermal, a survey of over 170 thermal engineers conducted by ...
Business Wire

Cadence Launches Celsius Thermal Solver, Delivering the Industry’s First Complete Electrical-Thermal Co-Simulation for System Analysis

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...
Electronic Design

Perform Thermal Simulation Early in the Layout Stage

It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...