Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
For quantum computers to outperform their classical counterparts, they need more quantum bits, or qubits. State-of-the-art ...
Sometimes to truly study something up close, you have to take a step back. That's what Andrea Donnellan does. An expert in Earth sciences and seismology, she gets much of her data from a bird's-eye ...
Abstract: A universal mathematical model for the radiation pattern of an antenna has recently been introduced which promises to enable rapid and versatile array synthesis. Here, that model is utilized ...
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