Ansys (NASDAQ: ANSS) achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS® with silicon interposer (CoWoS®-S) and InFO with RDL interconnect (InFO-R) ...
Ansys (NASDAQ: ANSS) achieved certification of its cutting-edge multiphysics signoff solutions for TSMC’s advanced N3 and N4 process technologies. This enables joint customers to meet critical power, ...
Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...
Ansys achieved new certifications of its leading-edge suite of semiconductor design solutions for all Samsung Foundry FinFET process nodes Ansys® RedHawk-SC™ was added to the certified suite to design ...
Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...
Modern Ansys Design Language elevates the user experience (UX) to create a new user interface (UI) paradigm across the Ansys (ANSS) multiphysics portfolio and increases accessibility Native Ansys ...
PITTSBURGH, Oct. 17, 2019 /PRNewswire/-- Samsung Foundry certified ANSYS (NASDAQ: ANSS) multiphysics simulation solutions for its latest multi-die integration TM (MDI ...
Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...
Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs) ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback